The practical application of 3D printers in the fabrication of a flexible heatsink for heat applications

dc.contributor.advisorKim, Jonghyun
dc.contributor.authorAlshammari, Talal
dc.date.accessioned2024-08-29T09:37:59Z
dc.date.available2024-08-29T09:37:59Z
dc.date.issued2024-02-15
dc.description.abstractThe innovative concept of converting solid thermal reducers into flexible counterparts has emerged as a captivating advancement in the realms of thermal management and material science. Flexible designs represent a dynamic and adaptable solution in the domain of thermal management. This study endeavors to concentrate on the meticulous design and manufacturing of high-performance heatsinks by using 3D printing with exceptional flexibility, specially tailored for effortless integration into collapsible electronic devices. The fabrication of heatsinks with varying ratios of Multi-Walled Carbon Nanotube (MWCNT) and Polydimethylsiloxane (PDMS) was conducted, and the optimal ratio was determined based on design elements (i.e., fin length, fin design, heat dissipation efficiency, tensile strength, flexibility, and bending moment analysis). The heatsink with 5% MWCNTs in PDMS displayed the optimal highest efficiency in heat dispersion. Bending and tension tests approved the excellent mechanical properties of the flexible heatsink. The effectiveness of the flexible heatsink based on MWCNT/PDMS has been proven experimentally to be wearable. These results reveal that the MWCNT/PDMS composite-based heatsink can be a good candidate in the thermal interface for the thermal management of electronic devices.
dc.format.extent88
dc.identifier.urihttps://hdl.handle.net/20.500.14154/72978
dc.language.isoen
dc.publisherKeimyung University
dc.subject3D Printers
dc.titleThe practical application of 3D printers in the fabrication of a flexible heatsink for heat applications
dc.typeThesis
sdl.degree.departmentMechanical Engineering
sdl.degree.disciplineMechanical Engineering
sdl.degree.grantorKeimyung
sdl.degree.nameMaster of Engineering

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