Review of High Power GaN LED: Thermal Management Using Flip Chip Bonding

dc.contributor.advisor	IBRAHIM HUSSAIN IBRAHIM KHAWAJI
dc.contributor.author	IBRAHIM HUSSAIN IBRAHIM KHAWAJI
dc.date	2013
dc.date	2013-07-18 15:13:29.697
dc.date.accessioned	2022-06-01T01:51:55Z
dc.date.available	2022-06-01T01:51:55Z
dc.degree.department	Prof. Jerzy Ruzyllo
dc.identifier.other	7323
dc.identifier.uri	https://drepo.sdl.edu.sa/handle/20.500.14154/54908
dc.publisher	Saudi Digital Library
dc.title	Review of High Power GaN LED: Thermal Management Using Flip Chip Bonding
dc.type	Thesis
sdl.thesis.level	Master
sdl.thesis.source	SACM - United States of America

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