Harnessing the Synergy of Copper Nanoparticles and Ascorbic Acid for Wound Healing

Abstract

Wound healing is a meticulously orchestrated biological process characterized by a harmonious interplay of various cellular and molecular elements aimed at restoring tissue integrity and function1. This intricate symphony involves immune cells, growth factors, extracellular matrix components, and signaling molecules working collaboratively to facilitate antimicrobial activity and stimulate vascular formation1. The journey of wound repair typically follows a well-defined sequence encompassing inflammation, proliferation, and remodeling phases, ensuring efficient tissue restoration2,3. However, this progression can be disrupted, leading to the development of chronic wounds characterized by persistent inflammation, impaired angiogenesis, and the presence of bacterial biofilms4,5. Chronic wounds present multifaceted challenges, with traditional antibiotic therapies often proving inadequate due to bacterial resistance, especially in cases involving biofilm-associated infections6. While strategies targeting angiogenesis have historically relied on bioactive molecules or growth factors7, the economic feasibility of such interventions remains a hurdle8. Moreover, the traditional focus on addressing antimicrobial and pro-angiogenic aspects separately underscores the need for an integrated approach that combines these facets within a unified drug delivery framework9. To comprehensively address these challenges, this study proposes an innovative strategy harnessing the unique properties of copper ions to develop a cost-effective scaffold tailored for chronic wound management10. Copper, recognized as a vital trace element essential for various physiological processes (Field 11), possesses inherent antimicrobial properties while exhibiting reduced toxicity to host cells (Field 12). This dual functionality positions copper as a promising candidate for both topical and systemic wound care interventions (Field 13). Incorporating L-ascorbic acid, or Vitamin C (VC), further enhances the antibacterial efficacy of copper nanoparticles while potentially reducing the required dosage (Field 14). Notably, copper also serves as a crucial co-factor for angiogenic promoters and mediators, implicating its role in regulating angiogenesis—a pivotal process for successful wound healing15,16. Consequently, the proposed scaffold not only addresses antimicrobial challenges but also actively participates in orchestrating angiogenic processes, offering a holistic approach to enhancing wound repair. The objective of this study is develop copper nanoparticles for wound healing application by means of harnessing the antibacterial and pro-angiogenic properties of copper ion17. Controlled release of copper ions during distinct wound repair phases will be achieved through tailored copper nanoparticle synthesis18. The proposed strategy involves synergistically integrating copper nanoparticles and VC elements within a hydrogel platform, presenting a cohesive approach that harnesses copper's antimicrobial prowess, exploits its pro-angiogenic potential, and leverages the scaffold functionality of hydrogels19.